JPH0252860B2 - - Google Patents

Info

Publication number
JPH0252860B2
JPH0252860B2 JP1661585A JP1661585A JPH0252860B2 JP H0252860 B2 JPH0252860 B2 JP H0252860B2 JP 1661585 A JP1661585 A JP 1661585A JP 1661585 A JP1661585 A JP 1661585A JP H0252860 B2 JPH0252860 B2 JP H0252860B2
Authority
JP
Japan
Prior art keywords
bonding
pattern
board
placement
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1661585A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61177733A (ja
Inventor
Takashi Kamiharashi
Mitsutada Yamazaki
Kazuo Kumagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP1661585A priority Critical patent/JPS61177733A/ja
Publication of JPS61177733A publication Critical patent/JPS61177733A/ja
Publication of JPH0252860B2 publication Critical patent/JPH0252860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP1661585A 1985-02-01 1985-02-01 ボンデイング方法 Granted JPS61177733A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1661585A JPS61177733A (ja) 1985-02-01 1985-02-01 ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1661585A JPS61177733A (ja) 1985-02-01 1985-02-01 ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS61177733A JPS61177733A (ja) 1986-08-09
JPH0252860B2 true JPH0252860B2 (en]) 1990-11-14

Family

ID=11921231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1661585A Granted JPS61177733A (ja) 1985-02-01 1985-02-01 ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS61177733A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132769U (en]) * 1988-02-29 1989-09-08

Also Published As

Publication number Publication date
JPS61177733A (ja) 1986-08-09

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